Heterogeneously Assembled Metamaterials and Metadevices via 3D Modular Transfer Printing.

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作者： Seungwoo,Lee ^[1] ; Byungsoo,Kang ^[2] ; Hohyun,Keum ^[3] ; Numair,Ahmed ^[3] ; John A,Rogers ^[4] ; Placid M,Ferreira ^[3] ; Seok,Kim ^[3] ; Bumki,Min ^[2]

作者单位： SKKU Advanced Institute of Nanotechnology (SAINT) &School of Chemical Engineering, Sungkyunkwan University (SKKU), Suwon 16419, Republic of Korea. ^[1] Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 34141, Republic of Korea. ^[2] Department of Mechanical Science and Engineering, University of Illinois, Urbana-Champaign, Illinois 61801, USA. ^[3] Department of Materials Science and Engineering, University of Illinois, Urbana-Champaign, Illinois 61801, USA. ^[4]

DOI 10.1038/srep27621

PMID 27283594

发布时间 2018-11-13

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