A Highly Active and Robust Copper-Based Electrocatalyst toward Hydrogen Evolution Reaction with Low Overpotential in Neutral Solution.

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作者： Jialei,Du ^[1] ; Jianying,Wang ^[1] ; Lvlv,Ji ^[1] ; Xiaoxiang,Xu ^[1] ; Zuofeng,Chen ^[1]

作者单位： Shanghai Key Lab of Chemical Assessment and Sustainability, School of Chemical Science and Engineering, Tongji University , Shanghai 200092, China. ^[1]

关键词 Cu-based nanoparticle film electrodeposition heterogeneous electrocatalysis hydrogen evolution reaction neutral pH

DOI 10.1021/acsami.6b09975

PMID 27748114

发布时间 2018-07-18

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ACS applied materials & interfaces

2016年8卷44期

30205-30211页

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A Highly Active and Robust Copper-Based Electrocatalyst toward Hydrogen Evolution Reaction with Low Overpotential in Neutral Solution.

ACS applied materials & interfaces

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ACS applied materials & interfaces

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A Highly Active and Robust Copper-Based Electrocatalyst toward Hydrogen Evolution Reaction with Low Overpotential in Neutral Solution.

ACS applied materials & interfaces

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ACS applied materials & interfaces

相关期刊

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