Surface-Localized Sealing of Porous Ultralow-k Dielectric Films with Ultrathin (<2 nm) Polymer Coating.

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作者： Seong Jun,Yoon ^[1] ; Kwanyong,Pak ^[2] ; Taewook,Nam ^[1] ; Alexander,Yoon ; Hyungjun,Kim ; Sung Gap,Im ; Byung Jin,Cho

作者单位： School of Electrical and Electronic Engineering, Yonsei University , Seoul 03722, Republic of Korea. ^[1] Lam Research Corporation , Fremont, California 94538, United States. ^[2]

关键词 Cu interconnects back-end of line process initiated chemical vapor deposition pore sealing ultralow-k dielectrics

DOI 10.1021/acsnano.7b01998

PMID 28723069

发布时间 2018-10-17

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ACS nano

2017年11卷8期

7841-7847页

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Surface-Localized Sealing of Porous Ultralow-k Dielectric Films with Ultrathin (<2 nm) Polymer Coating.

ACS nano

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Surface-Localized Sealing of Porous Ultralow-k Dielectric Films with Ultrathin (&lt;2 nm) Polymer Coating.

ACS nano

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ACS nano

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Surface-Localized Sealing of Porous Ultralow-k Dielectric Films with Ultrathin (<2 nm) Polymer Coating.