Interfacial Bonding Energy on the Interface between ZChSnSb/Sn Alloy Layer and Steel Body at Microscale.

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作者： Jianmei,Wang ^[1] ; Quanzhi,Xia ^[2] ; Yang,Ma ^[3] ; Fanning,Meng ^[4] ; Yinan,Liang ^[5] ; Zhixiong,Li ^[6]

作者单位： Engineering Research Center Heavy Machinery Ministry of Education, Taiyuan University of Science and Technology, Taiyuan 030024, China. wjmhdb@163.com. ^[1] Engineering Research Center Heavy Machinery Ministry of Education, Taiyuan University of Science and Technology, Taiyuan 030024, China. 18335100976@163.com. ^[2] Engineering Research Center Heavy Machinery Ministry of Education, Taiyuan University of Science and Technology, Taiyuan 030024, China. tilit2017@163.com. ^[3] Engineering Research Center Heavy Machinery Ministry of Education, Taiyuan University of Science and Technology, Taiyuan 030024, China. mfn0857@163.com. ^[4] Engineering Research Center Heavy Machinery Ministry of Education, Taiyuan University of Science and Technology, Taiyuan 030024, China. 13935124901@163.com. ^[5] School of Mechatronic Engineering, China University of Mining Technology, Xuzhou 221116, China. zhixiongli@whut.edu.cn. ^[6] School of Manufacturing & Mechanical Engineering, UNSW, Sydney 2200, Australia. zhixiongli@whut.edu.cn. ^[7]

关键词 Babbitt layer thickness Sn layer bonding strength interfacial bonding performances molecular dynamics

DOI 10.3390/ma10101128

PMID 28946690

发布时间 2024-03-27

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