作者单位：
Department of Physics, Materials Genome Institute, Shanghai Key Laboratory of High Temperature Superconductors, and International Centre for Quantum and Molecular Structures, Shanghai University, 200444, Shanghai, China.
[1]
Consiglio Nazionale delle Ricerche (CNR-SPIN), Via Vetoio, I-67100, L'Aquila, Italy.
[2]
School of Electronic Science and Engineering, and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, 210093, Nanjing, China.
[3]
National Laboratory of Solid State Microstructures, School of Physics, Collaborative Innovation Center of Advanced Microstructures, Nanjing University, 210093, Nanjing, China.
[4]
Department of Physics, Materials Genome Institute, Shanghai Key Laboratory of High Temperature Superconductors, and International Centre for Quantum and Molecular Structures, Shanghai University, 200444, Shanghai, China. renwei@shu.edu.cn.
[5]
State Key Laboratory of Solidification Processing, Northwestern Polytechnical University, Xi'an, 710072, China. renwei@shu.edu.cn.
[6]
DOI
10.1038/s41598-018-25478-6
PMID
29743631
发布时间
2019-11-20
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