Fabrication of Vacuum-Sealed Capacitive Micromachined Ultrasonic Transducer Arrays Using Glass Reflow Process.

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第一作者： Nguyen Van,Toan

第一单位： Microsystem Integration Center (μSIC), Tohoku University, Sendai 980-8579, Japan. nvtoan@nme.mech.tohoku.ac.jp.

作者： Nguyen Van,Toan ^[1] ; Shim,Hahng ^[2] ; Yunheub,Song ^[3] ; Takahito,Ono ^[4]

作者单位： Microsystem Integration Center (μSIC), Tohoku University, Sendai 980-8579, Japan. nvtoan@nme.mech.tohoku.ac.jp. ^[1] Department of Electronic Engineering, Hanyang University, Seoul 04763, Korea. yhsong2008@hanyang.ac.kr. ^[2] Graduate School of Engineering, Tohoku University, Sendai 980-8579, Japan. yhsong2008@hanyang.ac.kr. ^[3] Department of Electronic Engineering, Hanyang University, Seoul 04763, Korea. ^[4] Graduate School of Engineering, Tohoku University, Sendai 980-8579, Japan. hahng.shim@nme.mech.tohoku.ac.jp. ^[5]

关键词 anodic bonding capacitive micromachined ultrasonic transducer chemical sensing glass reflow process medical imaging non-destructive measurement

DOI 10.3390/mi7050076

PMID 30404250

发布时间 2023-09-28

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Fabrication of Vacuum-Sealed Capacitive Micromachined Ultrasonic Transducer Arrays Using Glass Reflow Process.

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Fabrication of Vacuum-Sealed Capacitive Micromachined Ultrasonic Transducer Arrays Using Glass Reflow Process.

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