Resist Filling Study for UV Nanoimprint Lithography Using Stamps with Various Micro/Nano Ratios.

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第一作者： Minqi,Yin

第一单位： College of Internet of Things Engineering, Hohai University, Changzhou 213022, China. hhucymq@163.com.

作者： Minqi,Yin ^[1] ; Hongwen,Sun ^[2] ; Haibin,Wang ^[3]

作者单位： College of Internet of Things Engineering, Hohai University, Changzhou 213022, China. hhucymq@163.com. ^[1] Jiangsu Key Laboratory of Power Transmission and Distribution Equipment Technology, 200 JinLing Road North, Changzhou 213022, China. hhucymq@163.com. ^[2] College of Internet of Things Engineering, Hohai University, Changzhou 213022, China. hwsun@hhu.edu.cn. ^[3] Jiangsu Key Laboratory of Power Transmission and Distribution Equipment Technology, 200 JinLing Road North, Changzhou 213022, China. hwsun@hhu.edu.cn. ^[4] College of Internet of Things Engineering, Hohai University, Changzhou 213022, China. 20021646@hhu.edu.cn. ^[5] Jiangsu Key Laboratory of Power Transmission and Distribution Equipment Technology, 200 JinLing Road North, Changzhou 213022, China. 20021646@hhu.edu.cn. ^[6]

关键词 micro/nano ratios multiscale cavities resist filling stamp ultraviolet (UV) nanoimprint lithography

DOI 10.3390/mi9070335

PMID 30424268

发布时间 2020-09-30

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Resist Filling Study for UV Nanoimprint Lithography Using Stamps with Various Micro/Nano Ratios.

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Resist Filling Study for UV Nanoimprint Lithography Using Stamps with Various Micro/Nano Ratios.

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