Plasma-Etched Pattern Transfer of Sub-10 nm Structures Using a Metal-Organic Resist and Helium Ion Beam Lithography.

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第一作者： Scott M,Lewis

第一单位： School of Chemistry and Photon Science Institute , The University of Manchester , Oxford Road , Manchester M13 9PL , United Kingdom.

作者： Scott M,Lewis ^[1] ; Matthew S,Hunt ^[2] ; Guy A,DeRose ^[2] ; Hayden R,Alty ^[2] ; Jarvis,Li ^[1] ; Alex,Wertheim ^[2] ; Lucia,De Rose ^[2] ; Grigore A,Timco ^[2] ; Axel,Scherer ^[1] ; Stephen G,Yeates ^[2] ; Richard E P,Winpenny ^[1]

作者单位： School of Chemistry and Photon Science Institute , The University of Manchester , Oxford Road , Manchester M13 9PL , United Kingdom. ^[1] Department of Applied Physics and Materials Science and the Kavli Nanoscience Institute , California Institute of Technology , 1200 East California Boulevard, MC 107-81 , Pasadena , California 91125 , United States. ^[2]

关键词 Metal?organic resist helium ion beam lithography high dry etch resistance high-resolution pattern ion beam resist

DOI 10.1021/acs.nanolett.9b01911

PMID 31424217

发布时间 2020-09-30

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