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A Novel Piezoresistive MEMS Pressure Sensors Based on Temporary Bonding Technology.

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第一作者： Peishuai,Song

第一单位： Engineering Research Center for Semiconductor Integrated Technology, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China.;The School of microelectronics & Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing 100049, China.

作者： Peishuai,Song ^[1] ; Chaowei,Si ^[1] ; Mingliang,Zhang ^[1] ; Yongmei,Zhao ^[1] ; Yurong,He ^[1] ; Wen,Liu ^[1] ; Xiaodong,Wang ^[2]

作者单位： Engineering Research Center for Semiconductor Integrated Technology, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China.;The School of microelectronics & Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing 100049, China. ^[1] Engineering Research Center for Semiconductor Integrated Technology, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China.;The School of microelectronics & Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing 100049, China.;Beijing Academy of Quantum Information Science, Beijing 100193, China.;Beijing Engineering Research Center of Semiconductor Micro-Nano Integrated Technology, Beijing 100083, China. ^[2]

关键词 blood pressure miniature piezoresistive pressure sensor temporary bonding technology

DOI 10.3390/s20020337

PMID 31936069

发布时间 2020-03-12

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