第一单位：
Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208.;Department of Aerospace and Mechanical Engineering, University of Southern California, Los Angeles, CA 90089.
作者：
Hangbo,Zhao [1]
;
Yongdeok,Kim [2]
;
Heling,Wang [3]
;
Xin,Ning [4]
;
Chenkai,Xu [5]
;
Judy,Suh [6]
;
Mengdi,Han [7]
;
Gelson J,Pagan-Diaz [8]
;
Wei,Lu [9]
;
Haibo,Li [3]
;
Wubin,Bai [10]
;
Onur,Aydin [11]
;
Yoonseok,Park [9]
;
Jiaojiao,Wang [8]
;
Yao,Yao [4]
;
Yishan,He [3]
;
M Taher A,Saif [11]
;
Yonggang,Huang [12]
;
Rashid,Bashir [13]
;
John A,Rogers [14]
作者单位：
Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208.;Department of Aerospace and Mechanical Engineering, University of Southern California, Los Angeles, CA 90089.
[1]
Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801.;Nick J. Holonyak Micro and Nanotechnology Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801.
[2]
Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60208.;Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL 60208.;Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208.
[3]
Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801.
[4]
Department of Biomedical Engineering, Northwestern University, Evanston, IL 60208.
[5]
Department of Chemistry, University of Illinois at Urbana-Champaign, Urbana, IL 61801.
[6]
Department of Biomedical Engineering, College of Future Technology, Peking University, 100871 Beijing, China.
[7]
Nick J. Holonyak Micro and Nanotechnology Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801.;Department of Bioengineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801.
[8]
Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208.
[9]
Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60208.
[10]
Department of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801.
[11]
Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208; y-huang@northwestern.edu rbashir@illinois.edu jrogers@northwestern.edu.;Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60208.;Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL 60208.;Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208.
[12]
Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801; y-huang@northwestern.edu rbashir@illinois.edu jrogers@northwestern.edu.;Nick J. Holonyak Micro and Nanotechnology Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801.;Department of Bioengineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801.;Department of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801.;Department of Biomedical and Translational Sciences, Carle Illinois College of Medicine, Urbana, IL 61801.
[13]
Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208; y-huang@northwestern.edu rbashir@illinois.edu jrogers@northwestern.edu.;Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801.;Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60208.;Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL 60208.;Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208.;Department of Biomedical Engineering, Northwestern University, Evanston, IL 60208.;Department of Neurological Surgery, Northwestern University Feinberg School of Medicine, Chicago, IL 60611.;Department of Chemistry, Northwestern University, Evanston, IL 60208.;Department of Electrical Engineering and Computer Science, Northwestern University, Evanston, IL 60208.
[14]
DOI
10.1073/pnas.2100077118
PMID
33941674
发布时间
2021-12-14
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