第一单位：
National Laboratory of Solid State Microstructures, School of Electronic Science and Engineering and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, China.
作者：
Wanqing,Meng [1]
;
Feifan,Xu [2]
;
Zhihao,Yu [3]
;
Tao,Tao [2]
;
Liangwei,Shao [1]
;
Lei,Liu [1]
;
Taotao,Li [4]
;
Kaichuan,Wen [5]
;
Jianpu,Wang [5]
;
Longbing,He [6]
;
Litao,Sun [6]
;
Weisheng,Li [1]
;
Hongkai,Ning [1]
;
Ningxuan,Dai [1]
;
Feng,Qin [7]
;
Xuecou,Tu [8]
;
Danfeng,Pan [8]
;
Shuzhuan,He [9]
;
Dabing,Li [10]
;
Youdou,Zheng [2]
;
Yanqing,Lu [11]
;
Bin,Liu [12]
;
Rong,Zhang [13]
;
Yi,Shi [14]
;
Xinran,Wang [15]
作者单位：
National Laboratory of Solid State Microstructures, School of Electronic Science and Engineering and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, China.
[1]
National Laboratory of Solid State Microstructures, School of Electronic Science and Engineering and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, China.;Jiangsu Provincial Key Laboratory of Advanced Photonic and Electronic Materials, Nanjing, China.
[2]
National Laboratory of Solid State Microstructures, School of Electronic Science and Engineering and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, China.;College of Electronic and Optical Engineering, Nanjing University of Posts and Telecommunications, Nanjing, China.
[3]
National Laboratory of Solid State Microstructures, School of Electronic Science and Engineering and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, China.;College of Engineering and Applied Sciences, Nanjing University, Nanjing, China.
[4]
Key Laboratory of Flexible Electronics (KLOFE) and Institution of Advanced Materials (IAM), Jiangsu National Synergetic Innovation Center for Advanced Materials (SICAM), Nanjing Tech University (NanjingTech), Nanjing, China.
[5]
SEU-FEI Nano-Pico Center, Key Lab of MEMS of Ministry of Education, Southeast University, Nanjing, China.
[6]
National Laboratory of Solid State Microstructures, School of Electronic Science and Engineering and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, China.;Tianma Microelectronics Co., Ltd, Shanghai, China.
[7]
National Laboratory of Solid State Microstructures, School of Electronic Science and Engineering and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, China.;Microfabrication and Integration Technology Center, Nanjing University, Nanjing, China.
[8]
Nanjing PureSemi Semiconductor Co., Ltd, Nanjing, China.
[9]
State Key Laboratory of Luminescence and Applications, Changchun Institute of Optics, Fine Mechanics and Physics, Chinese Academy of Sciences, Changchun, China.
[10]
College of Engineering and Applied Sciences, Nanjing University, Nanjing, China.
[11]
National Laboratory of Solid State Microstructures, School of Electronic Science and Engineering and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, China. bliu@nju.edu.cn.;Jiangsu Provincial Key Laboratory of Advanced Photonic and Electronic Materials, Nanjing, China. bliu@nju.edu.cn.
[12]
National Laboratory of Solid State Microstructures, School of Electronic Science and Engineering and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, China. rzhangxmu@xmu.edu.cn.;Jiangsu Provincial Key Laboratory of Advanced Photonic and Electronic Materials, Nanjing, China. rzhangxmu@xmu.edu.cn.;Collaborative Innovation Center for Optoelectronic Semiconductors and Efficient Devices, Department of Physics, Xiamen University, Xiamen, China. rzhangxmu@xmu.edu.cn.;Institute of Future Display Technology, Tan Kah Kee Innovation Laboratory, Xiamen, China. rzhangxmu@xmu.edu.cn.
[13]
National Laboratory of Solid State Microstructures, School of Electronic Science and Engineering and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, China. yshi@nju.edu.cn.;Jiangsu Provincial Key Laboratory of Advanced Photonic and Electronic Materials, Nanjing, China. yshi@nju.edu.cn.
[14]
National Laboratory of Solid State Microstructures, School of Electronic Science and Engineering and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, China. xrwang@nju.edu.cn.;Jiangsu Provincial Key Laboratory of Advanced Photonic and Electronic Materials, Nanjing, China. xrwang@nju.edu.cn.
[15]
DOI
10.1038/s41565-021-00966-5
PMID
34504324
发布时间
2023-02-06
换一批
