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Recent progress in silk fibroin-based flexible electronics.

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第一作者： Dan-Liang,Wen

第一单位： School of Electronic Science and Engineering, University of Electronic Science and Technology of China, Chengdu, 611731 China.

作者： Dan-Liang,Wen ^[1] ; De-Heng,Sun ^[1] ; Peng,Huang ^[1] ; Wen,Huang ^[1] ; Meng,Su ^[2] ; Ya,Wang ^[3] ; Meng-Di,Han ^[4] ; Beomjoon,Kim ^[2] ; Juergen,Brugger ^[3] ; Hai-Xia,Zhang ^[4] ; Xiao-Sheng,Zhang ^[1]

作者单位： School of Electronic Science and Engineering, University of Electronic Science and Technology of China, Chengdu, 611731 China. ^[1] CIRMM, Institute of Industrial Science, The University of Tokyo, Tokyo, 153-8505 Japan. ^[2] Microsystems Laboratory, École Polytechnique Fédérale de Lausanne (EPFL), 1015 Lausanne, Switzerland. ^[3] Institute of Microelectronics, Peking University, 100087 Beijing, China. ^[4]

关键词 Electrical and electronic engineering Electronic properties and materials

DOI 10.1038/s41378-021-00261-2

PMID 34567749

发布时间 2024-04-03

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2021年7卷

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