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Co-W Barrier Layers for Metallization of Copper Interconnects: Thermal Performance Analysis.

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第一作者： Bruno M C,Oliveira

第一单位： Department of Metallurgical and Materials Engineering, University of Porto, Rua Dr. Roberto Frias, 4200-465 Porto, Portugal.;LAETA/INEGI-Institute of Science and Innovation in Mechanical and Industrial Engineering, Rua Dr. Roberto Frias, 4200-465 Porto, Portugal.

作者： Bruno M C,Oliveira ^[1] ; Ruben F,Santos ^[1] ; Ana P,Piedade ^[2] ; Paulo J,Ferreira ^[3] ; Manuel F,Vieira ^[1]

作者单位： Department of Metallurgical and Materials Engineering, University of Porto, Rua Dr. Roberto Frias, 4200-465 Porto, Portugal.;LAETA/INEGI-Institute of Science and Innovation in Mechanical and Industrial Engineering, Rua Dr. Roberto Frias, 4200-465 Porto, Portugal. ^[1] CEMMPRE-Department of Mechanical Engineering, University of Coimbra, 3030-788 Coimbra, Portugal. ^[2] International Iberian Nanotechnology Laboratory, Av. Mestre José Veiga, 4715-330 Braga, Portugal.;Materials Science and Engineering Program, University of Texas at Austin, Austin, TX 78712, USA.;Mechanical Engineering Department and IDMEC, Instituto Superior Técnico, University of Lisbon, Av. Rovisco Pais, 1049-001 Lisboa, Portugal. ^[3]

关键词 barrier layers cobalt tungsten copper metallization dewetting

DOI 10.3390/nano12101752

PMID 35630972

发布时间 2022-07-16

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Co-W Barrier Layers for Metallization of Copper Interconnects: Thermal Performance Analysis.

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Co-W Barrier Layers for Metallization of Copper Interconnects: Thermal Performance Analysis.

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