作者：
Yuanjie,Su [1]
;
Weixiong,Li [1]
;
Xiaoxing,Cheng [2]
;
Yihao,Zhou [3]
;
Shuai,Yang [4]
;
Xu,Zhang [5]
;
Chunxu,Chen [1]
;
Tiannan,Yang [6]
;
Hong,Pan [1]
;
Guangzhong,Xie [1]
;
Guorui,Chen [3]
;
Xun,Zhao [3]
;
Xiao,Xiao [3]
;
Bei,Li [7]
;
Huiling,Tai [1]
;
Yadong,Jiang [1]
;
Long-Qing,Chen [2]
;
Fei,Li [8]
;
Jun,Chen [9]
作者单位：
State Key Laboratory of Electronic Thin Films and Integrated Devices, School of Optoelectronic Science and Engineering, University of Electronic Science and Technology of China, 610054, Chengdu, China.
[1]
Department of Materials Science and Engineering, The Pennsylvania State University, State College, PA, 16802, USA.
[2]
Department of Bioengineering, University of California, Los Angeles, Los Angeles, CA, 90095, USA.
[3]
Electronic Materials Research Lab, Key Lab of Education Ministry/International Center for Dielectric Research, School of Electronic and Information Engineering, State Key Laboratory for Mechanical Behavior of Materials, Xi'an Jiaotong University, 710049, Xi'an, China.
[4]
School of Materials Science and Engineering, Research Center for Materials Genome Engineering, Wuhan University of Technology, 430070, Wuhan, China.
[5]
Department of Materials Science and Engineering, The Pennsylvania State University, State College, PA, 16802, USA. tuy123@psu.edu.
[6]
School of Materials Science and Engineering, Research Center for Materials Genome Engineering, Wuhan University of Technology, 430070, Wuhan, China. libei@whut.edu.cn.
[7]
Electronic Materials Research Lab, Key Lab of Education Ministry/International Center for Dielectric Research, School of Electronic and Information Engineering, State Key Laboratory for Mechanical Behavior of Materials, Xi'an Jiaotong University, 710049, Xi'an, China. ful5@xjtu.edu.cn.
[8]
Department of Bioengineering, University of California, Los Angeles, Los Angeles, CA, 90095, USA. jun.chen@ucla.edu.
[9]
DOI
10.1038/s41467-022-32518-3
PMID
35982033
发布时间
2022-09-09
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