第一单位：
Querrey-Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA.
作者：
Jaeho,Shin [1]
;
Heling,Wang [2]
;
Kyeongha,Kwon [3]
;
Diana,Ostojich [4]
;
Zach,Christiansen [4]
;
Jaime,Berkovich [5]
;
Yoonseok,Park [1]
;
Zhengwei,Li [1]
;
Geumbee,Lee [1]
;
Rania,Nasif [6]
;
Ted S,Chung [1]
;
Chun-Ju,Su [1]
;
Jaeman,Lim [1]
;
Hitoki,Kubota [7]
;
Akihiko,Ikoma [7]
;
Yi-An,Lu [4]
;
Derrick H,Lin [8]
;
Shuai,Xu [9]
;
Anthony,Banks [10]
;
Jan-Kai,Chang [10]
;
John A,Rogers [11]
作者单位：
Querrey-Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA.
[1]
Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing, 100085, China.;Institute of Flexible Electronics Technology of THU, Jiaxing, Zhejiang, 314006, China.
[2]
Querrey-Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA.;School of Electrical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, 34141, Republic of Korea.
[3]
Wearifi Inc., Evanston, IL, 60201, USA.
[4]
Querrey-Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA.;Department of Materials Science and Engineering, Northwestern University, Evanston, IL, 60208, USA.
[5]
Querrey-Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA.;Department of Biomedical Engineering, Northwestern University, Evanston, IL, 60208, USA.
[6]
Maruho Co., Ltd., Osaka, 531-0071, Japan.
[7]
Department of Dermatology, Northwestern University, Chicago, IL, 60611, USA.
[8]
Querrey-Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA.;Department of Biomedical Engineering, Northwestern University, Evanston, IL, 60208, USA.;Department of Dermatology, Northwestern University, Chicago, IL, 60611, USA.
[9]
Querrey-Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA.;Wearifi Inc., Evanston, IL, 60201, USA.
[10]
Querrey-Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA.;Department of Materials Science and Engineering, Northwestern University, Evanston, IL, 60208, USA.;Department of Biomedical Engineering, Northwestern University, Evanston, IL, 60208, USA.;Department of Mechanical Engineering, Northwestern University, Evanston, IL, 60208, USA.;Department of Neurological Surgery, Northwestern University, Evanston, IL, 60208, USA.;Department of Chemistry, Northwestern University, Evanston, IL, 60208, USA.;Department of Chemical Engineering, Northwestern University, Evanston, IL, 60208, USA.;Department of Electrical Engineering and Computer Science, Northwestern University, Evanston, IL, 60208, USA.
[11]
DOI
10.1002/adhm.202202021
PMID
36337006
发布时间
2024-10-13
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