Silicon Wafer CMP Slurry Using a Hydrolysis Reaction Accelerator with an Amine Functional Group Remarkably Enhances Polishing Rate.

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作者： Jae-Young,Bae ^[1] ; Man-Hyup,Han ^[2] ; Seung-Jae,Lee ^[3] ; Eun-Seong,Kim ^[2] ; Kyungsik,Lee ^[3] ; Gon-Sub,Lee ^[3] ; Jin-Hyung,Park ^[4] ; Jea-Gun,Park ^[5]

作者单位： Department of Energy Engineering, Hanyang University, Seoul 04763, Korea. ^[1] Department of Nanoscale Semiconductor Engineering, Hanyang University, Seoul 04763, Korea. ^[2] Department of Electronic Engineering, Hanyang University, Seoul 04763, Korea. ^[3] UB Materials Inc., Yongin 17162, Korea. ^[4] Department of Nanoscale Semiconductor Engineering, Hanyang University, Seoul 04763, Korea.;Department of Electronic Engineering, Hanyang University, Seoul 04763, Korea. ^[5]

关键词 3D heterogeneous packaging chemical–mechanical planarization colloidal silica hydrolysis reaction accelerator processing in memory (PIM)silicon wafer (Si wafer)

DOI 10.3390/nano12213893

PMID 36364668

发布时间 2024-09-07

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Nanomaterials (Basel, Switzerland)

2022年12卷21期

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Silicon Wafer CMP Slurry Using a Hydrolysis Reaction Accelerator with an Amine Functional Group Remarkably Enhances Polishing Rate.

Nanomaterials (Basel, Switzerland)

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Nanomaterials (Basel, Switzerland)

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Silicon Wafer CMP Slurry Using a Hydrolysis Reaction Accelerator with an Amine Functional Group Remarkably Enhances Polishing Rate.

Nanomaterials (Basel, Switzerland)

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Nanomaterials (Basel, Switzerland)

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