作者：
Wenshuai,Gao [1]
;
Xiangde,Zhu [2]
;
Jin,Hu [3]
;
Shujing,Li [4]
;
Fawei,Zheng [4]
;
Hongwei,Zhang [5]
;
Min,Wu [5]
;
Guolin,Zheng [6]
;
Ning,Hao [2]
;
Ping,Zhang [4]
;
Wei,Ning [7]
;
Mingliang,Tian [8]
作者单位：
Institute of Physical Science and Information Technology, School of Physics and Materials Science, Anhui University, Hefei 230601, China; Anhui Province Key Laboratory of Condensed Matter Physics at Extreme Conditions, High Magnetic Field Laboratory, Chinese Academy of Sciences, Hefei 230031, China; Department of Physics, University of Science and Technology of China, Hefei 230026, China.
[1]
Anhui Province Key Laboratory of Condensed Matter Physics at Extreme Conditions, High Magnetic Field Laboratory, Chinese Academy of Sciences, Hefei 230031, China.
[2]
Department of Physics, Institute for Nanoscience and Engineering, University of Arkansas, Fayetteville, AR 72701, USA.
[3]
Institute of Applied Physics and Computational Mathematics, Beijing 100088, China.
[4]
Anhui Province Key Laboratory of Condensed Matter Physics at Extreme Conditions, High Magnetic Field Laboratory, Chinese Academy of Sciences, Hefei 230031, China; Department of Physics, University of Science and Technology of China, Hefei 230026, China.
[5]
Anhui Province Key Laboratory of Condensed Matter Physics at Extreme Conditions, High Magnetic Field Laboratory, Chinese Academy of Sciences, Hefei 230031, China; Department of Physics, University of Science and Technology of China, Hefei 230026, China; Schoo of Science, RMIT University, Melbourne, VIC3001, Australia.
[6]
Anhui Province Key Laboratory of Condensed Matter Physics at Extreme Conditions, High Magnetic Field Laboratory, Chinese Academy of Sciences, Hefei 230031, China. Electronic address: ningwei@hmfl.ac.cn.
[7]
Institute of Physical Science and Information Technology, School of Physics and Materials Science, Anhui University, Hefei 230601, China; Anhui Province Key Laboratory of Condensed Matter Physics at Extreme Conditions, High Magnetic Field Laboratory, Chinese Academy of Sciences, Hefei 230031, China; Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing 210093, China. Electronic address: tianml@hmfl.ac.cn.
[8]
DOI
10.1016/j.scib.2019.08.005
PMID
36659557
发布时间
2023-01-20
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