Structure Performance Correlation of N-Heterocyclic Oligomer Leveler for Acid Copper Plating of Advanced Interconnects.

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第一作者： Chuan,Peng

第一单位： School of Materials and Energy, University of Electronic Science and Technology of China, Chengdu 610054, China.

作者： Chuan,Peng ^[1] ; Yuehui,Zhai ^[2] ; Xianming,Chen ^[1] ; Chong,Wang ^[3] ; Yan,Hong ^[1] ; Yuanming,Chen ^[2] ; Wei,He ^[1] ; Guoyun,Zhou ^[1] ; Binyun,Liu ^[1]

作者单位： School of Materials and Energy, University of Electronic Science and Technology of China, Chengdu 610054, China. ^[1] Jiangxi Institute of Electronic Circuits, Pingxiang 337009, China. ^[2] Zhuhai ACCESS Semiconductor Co., Ltd., Zhuhai 519099, China. ^[3] Guangdong Key Laboratory of Enterprises on Electronic Chemicals, Guangdong Guanghua Tech. Co., Ltd., Zhuhai 515063, China. ^[4]

关键词 copper electroplating leveler oligomer throwing power

DOI 10.3390/molecules28062783

PMID 36985756

发布时间 2023-03-31

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准确一般字义偏差语意偏离译文作用小提交