Structure Performance Correlation of N-Heterocyclic Oligomer Leveler for Acid Copper Plating of Advanced Interconnects.
第一作者:
Chuan,Peng
第一单位:
School of Materials and Energy, University of Electronic Science and Technology of China, Chengdu 610054, China.
作者:
DOI
10.3390/molecules28062783
PMID
36985756
发布时间
2023-03-31
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