Ultrasonic-Enabled Nondestructive and Substrate-Independent Liquid Metal Ink Sintering.

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第一作者： Sanhu,Liu

第一单位： State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin, 150001, China.;School of Materials Science and Engineering, Harbin Institute of Technology, Harbin, 150001, China.

作者： Sanhu,Liu ^[1] ; Zhiwu,Xu ^[1] ; Guoqiang,Li ^[2] ; Zhengwei,Li ^[1] ; Zihan,Ye ^[2] ; Zirong,Xu ^[1] ; Wenjun,Chen ^[2] ; Dongdong,Jin ^[2] ; Xing,Ma ^[3]

作者单位： State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin, 150001, China.;School of Materials Science and Engineering, Harbin Institute of Technology, Harbin, 150001, China. ^[1] Sauvage Laboratory for Smart Materials, School of Materials Science and Engineering, Harbin Institute of Technology (Shenzhen), Shenzhen, Guangdong, 518055, China. ^[2] State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin, 150001, China.;Sauvage Laboratory for Smart Materials, School of Materials Science and Engineering, Harbin Institute of Technology (Shenzhen), Shenzhen, Guangdong, 518055, China. ^[3]

关键词 circuits fabrication flexible electronics liquid metal non-contact sintering ultrasonic sintering

DOI 10.1002/advs.202301292

PMID 37316967

发布时间 2024-09-23

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Advanced science (Weinheim, Baden-Wurttemberg, Germany)

2023年10卷23期

e2301292页

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Ultrasonic-Enabled Nondestructive and Substrate-Independent Liquid Metal Ink Sintering.

Advanced science (Weinheim, Baden-Wurttemberg, Germany)

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Advanced science (Weinheim, Baden-Wurttemberg, Germany)

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Ultrasonic-Enabled Nondestructive and Substrate-Independent Liquid Metal Ink Sintering.

Advanced science (Weinheim, Baden-Wurttemberg, Germany)

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Advanced science (Weinheim, Baden-Wurttemberg, Germany)

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