第一单位:
School of Microelectronics and Communication Engineering, Chongqing University, Chongqing 400044, China.
作者单位:
School of Microelectronics and Communication Engineering, Chongqing University, Chongqing 400044, China.
[1]
Beijing Smart-Chip Microelectronics Technology Co., Ltd., Beijing 100192, China.
[2]
DOI
10.3390/s23104943
PMID
37430859
发布时间
2023-07-18