Advancements in SiC-Reinforced Metal Matrix Composites for High-Performance Electronic Packaging: A Review of Thermo-Mechanical Properties and Future Trends.

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第一作者： Liyan,Lai

第一单位： School of Science, Shanghai Institute of Technology, Shanghai 201418, China.

作者： Liyan,Lai ^[1] ; Bing,Niu ^[1] ; Yuxiao,Bi ^[1] ; Yigui,Li ^[1] ; Zhuoqing,Yang ^[2]

作者单位： School of Science, Shanghai Institute of Technology, Shanghai 201418, China. ^[1] National Key Laboratory of Science and Technology on Micro/Nano Fabrication, School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University, Shanghai 200240, China. ^[2]

关键词 electronic packaging metal matrix composites silicon carbide thermo-mechanical properties

DOI 10.3390/mi14081491

PMID 37630026

发布时间 2023-08-28

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2023年14卷8期

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Advancements in SiC-Reinforced Metal Matrix Composites for High-Performance Electronic Packaging: A Review of Thermo-Mechanical Properties and Future Trends.

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Advancements in SiC-Reinforced Metal Matrix Composites for High-Performance Electronic Packaging: A Review of Thermo-Mechanical Properties and Future Trends.

Micromachines

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Micromachines

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