Ag and Sn Implications in 3-Polker Coins Forgeries Evidenced by Nondestructive Methods.

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作者： Ioan,Petean ^[1] ; Gertrud Alexandra,Paltinean ^[2] ; Adrian Catalin,Taut ^[3] ; Simona Elena,Avram ^[4] ; Emanoil,Pripon ^[5] ; Lucian,Barbu Tudoran ^[6] ; Gheorghe,Borodi ^[7]

作者单位： Faculty of Chemistry and Chemical Engineering, Babes-Bolyai University, 11 Arany Janos Street, 400028 Cluj-Napoca, Romania. ^[1] Department of Polymer Composites, Institute of Chemistry "Raluca Ripan", Babes-Bolyai University, 30 Fantanele Street, 400294 Cluj-Napoca, Romania. ^[2] Applied Electronics Department, Technical University of Cluj-Napoca, 400027 Cluj-Napoca, Romania. ^[3] Faculty of Materials and Environmental Engineering, Technical University of Cluj-Napoca, 103-105 Muncii Bd., 400641 Cluj-Napoca, Romania. ^[4] Zalau County Museum of History and Art, 9 Unirii Street, 450042 Zalau, Romania. ^[5] Faculty of Biology and Geology, Babes-Bolyai University, 44 Gheorghe Bilaşcu Street, 400015 Cluj-Napoca, Romania. ^[6] National Institute for Research and Development of Isotopic and Molecular Technologies, 65-103 Donath Street, 400293 Cluj-Napoca, Romania. ^[7]

关键词 Ag-plated copper SEM–EDX Sn-plated copper XRD forged 3-Polker microstructure

DOI 10.3390/ma16175809

PMID 37687501

发布时间 2023-09-11

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