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Universal protocol for the wafer-scale manufacturing of 2D carbon-based transducer layers for versatile biosensor applications.

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第一作者： Xiaoling,Lu

第一单位： Department of Informatics and Microsystem Technology, University of Applied Sciences Kaiserslautern, Amerikastrasse 1, Zweibruecken 66482, Germany.;Institute of Materials in Electrical Engineering 1, RWTH Aachen University, Sommerfeldstrasse 24, Aachen 52074, Germany.

作者： Xiaoling,Lu ^[1] ; Walid-Madhat,Munief ^[2] ; Pavel,Damborský ^[3] ; Alice,Kasjanow ^[4] ; Jaroslav,Katrlík ^[3] ; Vivek,Pachauri ^[1] ; Sven,Ingebrandt ^[5]

作者单位： Department of Informatics and Microsystem Technology, University of Applied Sciences Kaiserslautern, Amerikastrasse 1, Zweibruecken 66482, Germany.;Institute of Materials in Electrical Engineering 1, RWTH Aachen University, Sommerfeldstrasse 24, Aachen 52074, Germany. ^[1] Department of Informatics and Microsystem Technology, University of Applied Sciences Kaiserslautern, Amerikastrasse 1, Zweibruecken 66482, Germany.;RAM DE GmbH. Science Park 2, Saarbruecken 66123, Germany.;Department of Physical Chemistry, Saarland University, 66123 Saarbruecken, Germany. ^[2] Institute of Chemistry, Slovak Academy of Sciences, Dúbravská cesta 9, Bratislava, Slovakia. ^[3] Micronit GmbH, Konrad-Adenauer-Allee 11, 44263 Dortmund, Germany. ^[4] Department of Informatics and Microsystem Technology, University of Applied Sciences Kaiserslautern, Amerikastrasse 1, Zweibruecken 66482, Germany.;RAM DE GmbH. Science Park 2, Saarbruecken 66123, Germany.;Institute of Materials in Electrical Engineering 1, RWTH Aachen University, Sommerfeldstrasse 24, Aachen 52074, Germany. ^[5]

关键词 Gas-phase silanization Graphene-oxide Lithography Micro and nano-fabrication Sensor Thermal reduction Thin film Wafer-scale processing of (reduced) GO thin-films (WSPgo)

DOI 10.1016/j.mex.2023.102402

PMID 37846355

发布时间 2023-10-20

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Universal protocol for the wafer-scale manufacturing of 2D carbon-based transducer layers for versatile biosensor applications.

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Universal protocol for the wafer-scale manufacturing of 2D carbon-based transducer layers for versatile biosensor applications.

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