作者单位：
Hunan Provincial Key Laboratory of Low-Dimensional Structural Physics & Devices, School of Physics and Electronics, Hunan University, Changsha, 410082, China.
[1]
Engineering Research Center of Advanced Semiconductor Technology and Application of Ministry of Education & Key Laboratory for Micro-/Nano-Optoelectronic Devices of Ministry of Education, College of Semiconductors (College of Integrated Circuits), Hunan University, Changsha, 410082, China.
[2]
State Key Laboratory for Chemo/Biosensing and Chemometrics, College of Chemistry and Chemical Engineering, Hunan Key Laboratory of Two-Dimensional Materials, Engineering Research Center of Advanced Catalysis of the Ministry of Education, Hunan University, Changsha, 410082, China.
[3]
Department of Materials Science and Engineering, University of Washington, Seattle, WA, 98195-2120, USA.
[4]
Changsha Semiconductor Technology and Application Innovation Research Institute, College of Semiconductors (College of Integrated Circuits), Hunan University, Changsha, 410082, China.
[5]
College of Materials Science and Engineering, Hunan University, Changsha, Hunan, 410082, China.
[6]
State Key Laboratory of Disaster Prevention & Reduction for Power Grid (Hunan Electric Power Corporation Disaster Prevention and Reduction Center), Changsha, 410007, China.
[7]
DOI
10.1002/smll.202310475
PMID
38229534
发布时间
2024-06-26
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