Weld-free mounting of lamellae for electrical biasing operando TEM.

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第一作者： Oscar,Recalde-Benitez

第一单位： Advanced Electron Microscopy Division, Institute of Materials Science, Technische Universität Darmstadt, Peter-Grünberg-Straße 2, Darmstadt 64287, Germany.

作者： Oscar,Recalde-Benitez ^[1] ; Yevheniy,Pivak ^[2] ; Tianshu,Jiang ^[1] ; Robert,Winkler ^[1] ; Alexander,Zintler ^[1] ; Esmaeil,Adabifiroozjaei ^[1] ; Philipp,Komissinskiy ^[3] ; Lambert,Alff ^[3] ; William A,Hubbard ^[4] ; H Hugo,Perez-Garza ^[2] ; Leopoldo,Molina-Luna ^[5]

作者单位： Advanced Electron Microscopy Division, Institute of Materials Science, Technische Universität Darmstadt, Peter-Grünberg-Straße 2, Darmstadt 64287, Germany. ^[1] DENSsolutions BV, Delft, the Netherlands. ^[2] Advanced Thin Film Technology Division, Institute of Materials Science, Technische Universität Darmstadt, Peter-Grünberg-Straße 2, Darmstadt 64287, Germany. ^[3] NanoElectronic Imaging, Inc., Los Angeles, CA, USA. ^[4] Advanced Electron Microscopy Division, Institute of Materials Science, Technische Universität Darmstadt, Peter-Grünberg-Straße 2, Darmstadt 64287, Germany. Electronic address: leopoldo.molina-luna@tu-darmstadt.de. ^[5]

关键词 FIB-based sample preparation In situ TEM biasing MEMS-based chips MIM devices

DOI 10.1016/j.ultramic.2024.113939

PMID 38401296

发布时间 2024-03-23

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