作者：
Xiaokang,Yao [1]
;
Yuxin,Li [2]
;
Huifang,Shi [1]
;
Ze,Yu [1]
;
Beishen,Wu [1]
;
Zixing,Zhou [1]
;
Chifeng,Zhou [2]
;
Xifang,Zheng [1]
;
Mengting,Tang [1]
;
Xiao,Wang [1]
;
Huili,Ma [2]
;
Zhengong,Meng [1]
;
Wei,Huang [1]
;
Zhongfu,An [1]
作者单位：
Key Laboratory of Flexible Electronics (KLoFE) & Institute of Advanced Materials (IAM), School of Flexible Electronics (Future Technologies), Nanjing Tech University (NanjingTech), Nanjing, China.
[1]
The Institute of Flexible Electronics (IFE, Future Technologies), Xiamen University, Xiamen, China.
[2]
Frontiers Science Center for Flexible Electronics (FSCFE), MIIT Key Laboratory of Flexible Electronics (KLoFE), Northwestern Polytechnical University, Xi'an, China.
[3]
Henan Institute of Flexible Electronics (HIFE) and School of Flexible Electronics (SoFE), Henan University, Zhengzhou, China.
[4]
Key Laboratory of Flexible Electronics (KLoFE) & Institute of Advanced Materials (IAM), School of Flexible Electronics (Future Technologies), Nanjing Tech University (NanjingTech), Nanjing, China. iamzfan@njtech.edu.cn.
[5]
The Institute of Flexible Electronics (IFE, Future Technologies), Xiamen University, Xiamen, China. iamzfan@njtech.edu.cn.
[6]
Henan Institute of Flexible Electronics (HIFE) and School of Flexible Electronics (SoFE), Henan University, Zhengzhou, China. iamzfan@njtech.edu.cn.
[7]
DOI
10.1038/s41467-024-48856-3
PMID
38806515
发布时间
2024-05-31
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