第一单位：
School of Electronic Information and Electrical Engineering, Institute of Advanced Study, Chengdu University, Chengdu, 610106, China. guojunxiong@cdu.edu.cn.;School of Integrated Circuit Science and Engineering, National Exemplary School of Microelectronics, University of Electronic Science and Technology of China, Chengdu, 610054, China. guojunxiong@cdu.edu.cn.
作者：
Junxiong,Guo [1]
;
Shuyi,Gu [2]
;
Lin,Lin [3]
;
Yu,Liu [4]
;
Ji,Cai [2]
;
Hongyi,Cai [2]
;
Yu,Tian [5]
;
Yuelin,Zhang [5]
;
Qinghua,Zhang [6]
;
Ze,Liu [2]
;
Yafei,Zhang [2]
;
Xiaosheng,Zhang [3]
;
Yuan,Lin [7]
;
Wen,Huang [8]
;
Lin,Gu [9]
;
Jinxing,Zhang [10]
作者单位：
School of Electronic Information and Electrical Engineering, Institute of Advanced Study, Chengdu University, Chengdu, 610106, China. guojunxiong@cdu.edu.cn.;School of Integrated Circuit Science and Engineering, National Exemplary School of Microelectronics, University of Electronic Science and Technology of China, Chengdu, 610054, China. guojunxiong@cdu.edu.cn.
[1]
School of Electronic Information and Electrical Engineering, Institute of Advanced Study, Chengdu University, Chengdu, 610106, China.
[2]
School of Integrated Circuit Science and Engineering, National Exemplary School of Microelectronics, University of Electronic Science and Technology of China, Chengdu, 610054, China.
[3]
School of Integrated Circuits, Tsinghua University, Beijing, 100084, China. y-liu-17@tsinghua.org.cn.;College of Integrated Circuit Science and Engineering, National and Local Joint Engineering Laboratory for RF Integration and Micro-Packing Technologies, Nanjing University of Posts and Telecommunications, Nanjing, 210023, China. y-liu-17@tsinghua.org.cn.
[4]
School of Physics and Astronomy, Beijing Normal University, Beijing, 100875, China.;Key Laboratory of Multiscale Spin Physics, Ministry of Education, Beijing, 100875, China.
[5]
Institute of Physics, Chinese Academy of Science, Beijing National Laboratory of Condensed Matter Physics, Beijing, 100190, China.
[6]
School of Materials and Energy, University of Electronic Science and Technology of China, Chengdu, 610054, China.
[7]
School of Integrated Circuit Science and Engineering, National Exemplary School of Microelectronics, University of Electronic Science and Technology of China, Chengdu, 610054, China. uestchw@uestc.edu.cn.
[8]
School of Materials Science and Engineering, Tsinghua University, Beijing, 100084, China.
[9]
School of Physics and Astronomy, Beijing Normal University, Beijing, 100875, China. jxzhang@bnu.edu.cn.;Key Laboratory of Multiscale Spin Physics, Ministry of Education, Beijing, 100875, China. jxzhang@bnu.edu.cn.
[10]
DOI
10.1038/s41467-024-49592-4
PMID
38890366
发布时间
2024-07-07
换一批
换一批
