Double-Sided Bonding Process Enables X-ray Flat Panel Detectors.

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作者： Hui,Zhang ^[1] ; Shujie,Tie ^[2] ; Jiajiu,Ye ^[3] ; Zihan,Wang ^[1] ; Changmao,Wan ^[1] ; Shendong,Xu ^[3] ; Yuli,Tao ^[1] ; Zheng,Liang ^[1] ; Huifen,Xu ^[1] ; Jinfeng,Li ^[4] ; Xiaojia,Zheng ^[2] ; Xu,Pan ^[3]

作者单位： Institute of Solid-State Physics, Hefei Institutes of Physical Science, Chinese Academy of Science, Hefei 230031, China.;University of Science and Technology of China, Hefei 230026, China. ^[1] Sichuan Research Center of New Materials, Institute of Chemical Materials, China Academy of Engineering Physics, Chengdu 610200, Sichuan, China. ^[2] Institute of Solid-State Physics, Hefei Institutes of Physical Science, Chinese Academy of Science, Hefei 230031, China. ^[3] Institute of Systems Engineering, Chinese People's Liberation Army Academy of Military Sciences, Beijing 100141, China. ^[4]

关键词 X-ray detectors double-sided bonding (DSB)large-size wafer ultralow detection limit δ-CsPbI3

DOI 10.1021/acsami.4c06863

PMID 38993025

发布时间 2024-07-25

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