Diamond-Reinforced Al(H2PO4)3@Epoxy Hybrid Thermal Adhesive With Ultra-High Thermal Conductivity and Bonding Strength.

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作者： Ge,Gao ^[1] ; Yuwei,Zhao ^[2] ; Wenxin,Cao ^[3] ; Zhenhua,Su ^[1] ; Xiaolei,Wang ^[1] ; Zhuochao,Wang ^[1] ; Tingting,Sun ^[1] ; Bing,Dai ^[1] ; Jiecai,Han ^[1] ; Bohong,Li ^[4] ; Chao,Wang ^[4] ; Jiaqi,Zhu ^[3]

作者单位： National Key Laboratory of Science and Technology on Advanced Composites in Special Environments, Harbin Institute of Technology, Harbin, 150080, P. R. China. ^[1] Luoyang Ship Material Research Institute, Luoyang, Henan, 471000, P. R. China. ^[2] National Key Laboratory of Science and Technology on Advanced Composites in Special Environments, Harbin Institute of Technology, Harbin, 150080, P. R. China.;Zhengzhou Research Institute, Harbin Institute of Technology, Zhengzhou, 450000, P. R. China. ^[3] Institute of Petrochemistry Heilongjiang Academy of Sciences, Harbin, 150040, P. R. China. ^[4]

关键词 aluminum dihydrogen phosphate diamonds organic/inorganic hybrid thermal interface materials thermally conductive composite

DOI 10.1002/smll.202403490

PMID 39031997

发布时间 2024-11-01

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