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Wafer Level Vacuum Packaging of MEMS-Based Uncooled Infrared Sensors.

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第一作者： Gulsah,Demirhan Aydin

第一单位： METU MEMS Centre, Middle East Technical University, Ankara 06530, Turkey.;Electrical and Electronics Engineering Department, Baskent University, Ankara 06790, Turkey.

作者： Gulsah,Demirhan Aydin ^[1] ; Orhan Sevket,Akar ^[2] ; Tayfun,Akin ^[3]

作者单位： METU MEMS Centre, Middle East Technical University, Ankara 06530, Turkey.;Electrical and Electronics Engineering Department, Baskent University, Ankara 06790, Turkey. ^[1] METU MEMS Centre, Middle East Technical University, Ankara 06530, Turkey. ^[2] MikroSens Elektronik San ve Tic A.S., Ankara 06530, Turkey.;Electrical and Electronics Engineering Department, Middle East Technical University, Ankara 06800, Turkey. ^[3]

关键词 TLP bonding glass frit bonding grating structures hermetic encapsulation infrared detector packaging wafer level vacuum packaging (WLVP)

DOI 10.3390/mi15080935

PMID 39203586

发布时间 2024-09-01

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