The impact of sidewall copper grain condition on thermo-mechanical behaviors of TSVs during the annealing process.

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作者： Yang,Xi ^[1] ; Yunpeng,Zhang ^[2] ; Zhiqaing,Tian ^[3] ; Tianjian,Liu ^[2] ; Can,Sheng ^[2] ; Bo,Zhao ^[2] ; Zhaofu,Zhang ^[1] ; Shizhao,Wang ^[4] ; Sheng,Liu ^[5]

作者单位： The Institute of Technological Sciences, Wuhan University, Wuhan, 430072, China. ^[1] School of Mechanical Science and Engineering, Huazhong University of Science and Technology, Wuhan, 430074, China. ^[2] School of Power and Mechanical Engineering, Wuhan University, Wuhan, 430072, China. ^[3] School of Power and Mechanical Engineering, Wuhan University, Wuhan, 430072, China. wangshizhao@whu.edu.cn. ^[4] The Institute of Technological Sciences, Wuhan University, Wuhan, 430072, China. shengliu@whu.edu.cn.;School of Power and Mechanical Engineering, Wuhan University, Wuhan, 430072, China. shengliu@whu.edu.cn. ^[5]

DOI 10.1038/s41378-024-00830-1

PMID 39681566

发布时间 2025-01-04

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Microsystems & nanoengineering

2024年10卷1期

194页

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The impact of sidewall copper grain condition on thermo-mechanical behaviors of TSVs during the annealing process.

Microsystems & nanoengineering

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Microsystems & nanoengineering

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The impact of sidewall copper grain condition on thermo-mechanical behaviors of TSVs during the annealing process.

Microsystems & nanoengineering

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Microsystems & nanoengineering

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