第一单位：
Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, MA, USA.;Research Laboratory of Electronics, Massachusetts Institute of Technology, Cambridge, MA, USA.
作者：
Ki Seok,Kim [1]
;
Seunghwan,Seo [1]
;
Junyoung,Kwon [2]
;
Doyoon,Lee [3]
;
Changhyun,Kim [2]
;
Jung-El,Ryu [1]
;
Jekyung,Kim [1]
;
Jun Min,Suh [1]
;
Hang-Gyo,Jung [4]
;
Youhwan,Jo [5]
;
June-Chul,Shin [1]
;
Min-Kyu,Song [1]
;
Jin,Feng [1]
;
Hogeun,Ahn [4]
;
Sangho,Lee [1]
;
Kyeongjae,Cho [5]
;
Jongwook,Jeon [4]
;
Minsu,Seol [6]
;
Jin-Hong,Park [7]
;
Sang Won,Kim [8]
;
Jeehwan,Kim [9]
作者单位：
Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, MA, USA.;Research Laboratory of Electronics, Massachusetts Institute of Technology, Cambridge, MA, USA.
[1]
2D Device Laboratory, Samsung Advanced Institute of Technology, Suwon, Korea.;Device Research Center, Samsung Advanced Institute of Technology, Suwon, Korea.
[2]
Research Laboratory of Electronics, Massachusetts Institute of Technology, Cambridge, MA, USA.;Department of Materials Science and Engineering, Massachusetts Institute of Technology, Cambridge, MA, USA.
[3]
Department of Electrical and Computer Engineering Sungkyunkwan University, Suwon-si, South Korea.
[4]
Department of Materials Science and Engineering, The University of Texas at Dallas, Richardson, TX, USA.
[5]
2D Device Laboratory, Samsung Advanced Institute of Technology, Suwon, Korea. minsu.seol@samsung.com.;Device Research Center, Samsung Advanced Institute of Technology, Suwon, Korea. minsu.seol@samsung.com.
[6]
Department of Electrical and Computer Engineering Sungkyunkwan University, Suwon-si, South Korea. jhpark9@skku.edu.;SKKU Advanced Institute of Nano Technology (SAINT), Sungkyunkwan University, Suwon-si, South Korea. jhpark9@skku.edu.
[7]
2D Device Laboratory, Samsung Advanced Institute of Technology, Suwon, Korea. swon80.kim@samsung.com.;Device Research Center, Samsung Advanced Institute of Technology, Suwon, Korea. swon80.kim@samsung.com.
[8]
Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, MA, USA. jeehwan@mit.edu.;Research Laboratory of Electronics, Massachusetts Institute of Technology, Cambridge, MA, USA. jeehwan@mit.edu.;2D Device Laboratory, Samsung Advanced Institute of Technology, Suwon, Korea. jeehwan@mit.edu.;Device Research Center, Samsung Advanced Institute of Technology, Suwon, Korea. jeehwan@mit.edu.;Department of Materials Science and Engineering, Massachusetts Institute of Technology, Cambridge, MA, USA. jeehwan@mit.edu.
[9]
DOI
10.1038/s41586-024-08236-9
PMID
39695208
发布时间
2024-12-26
换一批
