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The application of multi-scale simulation in advanced electronic packaging.

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第一作者： Wei,Yu

第一单位： School of Electrical Engineering and Automation, Wuhan University, Wuhan 430072, China.

作者： Wei,Yu ^[1] ; Shucan,Cheng ^[1] ; Zeyuan,Li ^[2] ; Li,Liu ^[3] ; Zhaofu,Zhang ^[4] ; Yanpu,Zhao ^[1] ; Yuzheng,Guo ^[5] ; Sheng,Liu ^[6]

作者单位： School of Electrical Engineering and Automation, Wuhan University, Wuhan 430072, China. ^[1] School of Power and Mechanical Engineering, Wuhan University, Wuhan 430072, China. ^[2] School of Materials Science and Engineering, Wuhan University of Technology, Wuhan 430070, China. ^[3] The Institute of Technological Sciences, Wuhan University, Wuhan 430072, China. ^[4] School of Power and Mechanical Engineering, Wuhan University, Wuhan 430072, China.;School of Electrical Engineering and Automation, Wuhan University, Wuhan 430072, China.;The Institute of Technological Sciences, Wuhan University, Wuhan 430072, China. ^[5] School of Power and Mechanical Engineering, Wuhan University, Wuhan 430072, China.;The Institute of Technological Sciences, Wuhan University, Wuhan 430072, China. ^[6]

关键词 Advanced electronic packaging Electronic devices Machine learning methods Multi-scale simulation Multiphysics coupling

DOI 10.1016/j.fmre.2024.04.004

PMID 39734517

发布时间 2025-01-04

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Fundamental research

2024年4卷6期

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