第一单位：
Department of Materials Science and Engineering, Massachusetts Institute of Technology, Cambridge, MA, USA.
作者：
Xinyuan,Zhang [1]
;
Owen,Ericksen [2]
;
Sangho,Lee [3]
;
Marx,Akl [4]
;
Min-Kyu,Song [3]
;
Haihui,Lan [5]
;
Pratap,Pal [2]
;
Jun Min,Suh [3]
;
Shane,Lindemann [2]
;
Jung-El,Ryu [3]
;
Yanjie,Shao [6]
;
Xudong,Zheng [7]
;
Ne Myo,Han [3]
;
Bikram,Bhatia [8]
;
Hyunseok,Kim [9]
;
Hyun S,Kum [10]
;
Celesta S,Chang [11]
;
Yunfeng,Shi [12]
;
Chang-Beom,Eom [13]
;
Jeehwan,Kim [14]
作者单位：
Department of Materials Science and Engineering, Massachusetts Institute of Technology, Cambridge, MA, USA.
[1]
Department of Materials Science and Engineering, University of Wisconsin-Madison, Madison, WI, USA.
[2]
Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, MA, USA.
[3]
Department of Materials Science and Engineering, Rensselaer Polytechnic Institute, Troy, NY, USA.
[4]
Department of Chemistry, Massachusetts Institute of Technology, Cambridge, MA, USA.
[5]
Microsystems Technology Laboratories, Massachusetts Institute of Technology, Cambridge, MA, USA.;Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology, Cambridge, MA, USA.
[6]
Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology, Cambridge, MA, USA.
[7]
Department of Mechanical Engineering, University of Louisville, Louisville, KY, USA.
[8]
Department of Electrical and Computer Engineering, University of Illinois Urbana-Champaign, Urbana, IL, USA.
[9]
Department of Electrical and Electronic Engineering, Yonsei University, Seoul, Republic of Korea.
[10]
Department of Physics and Astronomy, Seoul National University, Seoul, Republic of Korea. celesta@snu.ac.kr.
[11]
Department of Materials Science and Engineering, Rensselaer Polytechnic Institute, Troy, NY, USA. shiy2@rpi.edu.
[12]
Department of Materials Science and Engineering, University of Wisconsin-Madison, Madison, WI, USA. ceom@wisc.edu.
[13]
Department of Materials Science and Engineering, Massachusetts Institute of Technology, Cambridge, MA, USA. jeehwan@mit.edu.;Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, MA, USA. jeehwan@mit.edu.;Microsystems Technology Laboratories, Massachusetts Institute of Technology, Cambridge, MA, USA. jeehwan@mit.edu.;Research Laboratory of Electronics, Massachusetts Institute of Technology, Cambridge, MA, USA. jeehwan@mit.edu.
[14]
DOI
10.1038/s41586-025-08874-7
PMID
40269153
发布时间
2025-04-24
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