第一单位：
Department of Mechanical Engineering and Material Science, Duke University, Durham, NC 27708, USA.
作者：
Chenhang,Li [1]
;
Heling,Wang [2]
;
Ziwu,Song [3]
;
Wei,Zhang [4]
;
Yuxin,Pan [1]
;
Zihao,Zhao [5]
;
Chaorui,Qiu [1]
;
Kaiping,Yin [1]
;
Mengdi,Han [6]
;
Allison Bingqing,Wang [7]
;
Haiwen,Luan [6]
;
Jiahong,Li [8]
;
Wenyuan,Yan [8]
;
Shulin,Chen [9]
;
Haixu,Shen [8]
;
Tzu-Li,Liu [9]
;
Sabrina S M,Lee [7]
;
Wenbo,Ding [5]
;
Yonggang,Huang [10]
;
John A,Rogers [11]
;
Changsheng,Wu [12]
;
Xiaoyue,Ni [13]
作者单位：
Department of Mechanical Engineering and Material Science, Duke University, Durham, NC 27708, USA.
[1]
Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing 100084, China.;Institute of Flexible Electronics Technology of THU Zhejiang, Jiaxing 314000, China.;Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL 60208, USA.
[2]
Department of Materials Science and Engineering, National University of Singapore, Singapore 117575, Singapore.;Shenzhen International Graduate School, Tsinghua University, Shenzhen 518055, China.
[3]
Department of Materials Science and Engineering, National University of Singapore, Singapore 117575, Singapore.;Institute for Health Innovation and Technology, National University of Singapore, Singapore 117599, Singapore.
[4]
Shenzhen International Graduate School, Tsinghua University, Shenzhen 518055, China.
[5]
Querry Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA.
[6]
Department of Physical Therapy and Human Movement Sciences, Northwestern University, Chicago, IL 60611, USA.
[7]
Department of Material Science and Engineering, Northwestern University, Evanston, IL 60208, USA.
[8]
Department of Biomedical Engineering, Northwestern University, Evanston, IL 60208, USA.
[9]
Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL 60208, USA.;Querry Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA.;Department of Material Science and Engineering, Northwestern University, Evanston, IL 60208, USA.;Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA.
[10]
Querry Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA.;Department of Material Science and Engineering, Northwestern University, Evanston, IL 60208, USA.;Department of Biomedical Engineering, Northwestern University, Evanston, IL 60208, USA.;Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA.;Department of Neurological Surgery, Feinberg School of Medicine, Northwestern University, Chicago, IL 60611, USA.
[11]
Department of Materials Science and Engineering, National University of Singapore, Singapore 117575, Singapore.;Institute for Health Innovation and Technology, National University of Singapore, Singapore 117599, Singapore.;The N.1 Institute for Health, National University of Singapore, Singapore 117456, Singapore.;Department of Electrical and Computer Engineering, National University of Singapore, Singapore 117583, Singapore.
[12]
Department of Mechanical Engineering and Material Science, Duke University, Durham, NC 27708, USA.;Department of Biostatistics and Bioinformatics, Duke University, Durham, NC 27710, USA.
[13]
DOI
10.1126/sciadv.ady0534
PMID
40901956
发布时间
2026-03-07
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