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A Review of Embedded Artificial Intelligence Research (2023-2026): Technological Advancements, Representative Advances, and Future Prospects.

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第一作者： Zhaoyun,Zhang

第一单位： School of Electrical Engineering and Intelligentization, DongGuan University of Technology, Dongguan 523000, China.

作者： Zhaoyun,Zhang ^[1]

作者单位： School of Electrical Engineering and Intelligentization, DongGuan University of Technology, Dongguan 523000, China. ^[1]

关键词 cross-platform standardization edge-cloud collaboration embedded artificial intelligence embodied intelligence federated edge learning full on-device training in-memory computing model lightweighting neuromorphic computing

DOI 10.3390/mi17050586

PMID 42195503

发布时间 2026-05-27

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2026年17卷5期

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A Review of Embedded Artificial Intelligence Research (2023-2026): Technological Advancements, Representative Advances, and Future Prospects.

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A Review of Embedded Artificial Intelligence Research (2023-2026): Technological Advancements, Representative Advances, and Future Prospects.

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