作者：
Ouyang, Wei [1]
;
Winsnes, Casper F. [2]
;
Hjelmare, Martin [3]
;
Cesnik, Anthony J. [4]
;
Akesson, Lovisa [5]
;
Xu, Hao [6]
;
Sullivan, Devin P. [6]
;
Dai, Shubin [6]
;
Lan, Jun [7]
;
Jinmo, Park [8]
;
Galib, Shaikat M. [9]
;
Henkel, Christof [10]
;
Hwang, Kevin [5]
;
Poplavskiy, Dmytro [6]
;
Tunguz, Bojan [11]
;
Wolfinger, Russel D. [12]
;
Gu, Yinzheng [13]
;
Li, Chuanpeng [14]
;
Xie, Jinbin [6]
;
Buslov, Dmitry [6]
;
Fironov, Sergei [15]
;
Kiselev, Alexander [6]
;
Panchenko, Dmytro [5]
;
Cao, Xuan [16]
;
Wei, Runmin [17]
;
Wu, Yuanhao ;
Zhu, Xun ;
Tseng, Kuan-Lun ;
Gao, Zhifeng ;
Ju, Cheng ;
Yi, Xiaohan ;
Zheng, Hongdong ;
Kappel, Constantin ;
Lundberg, Emma
作者单位：
Qualcomm Inc, Cupertino, CA USA
[1]
BDO Unicon, St Petersburg, Russia
[2]
Peking Univ, Beijing, Peoples R China
[3]
Leica Microsyst, Mannheim, Germany
[4]
Jilian Technol Grp Video, Shanghai, Peoples R China
[5]
KTH Royal Inst Technol, Sci Life Lab, Sch Engn Sci Chem Biotechnol & Hlth, Stockholm, Sweden
[6]
Missouri Univ Sci & Technol, Rolla, MO 65409 USA
[7]
Stanford Univ, Dept Genet, Stanford, CA 94305 USA
[8]
H2O Ai, Greencastle, IN USA
[9]
Univ Calif Berkeley, Berkeley, CA 94720 USA
[10]
Winning Hlth Technol Grp Co Ltd, Shanghai, Peoples R China
[11]
SAS Inst Inc, Cary, NC USA
[12]
SAP, Moscow, Russia
[13]
Khumbu Ai, Munich, Germany
[14]
UT MD Anderson Canc Ctr, Houston, TX USA
[15]
Univ Hawaii, Ctr Canc, Honolulu, HI 96822 USA
[16]
Microsoft Res, Beijing, Peoples R China
[17]
发布时间
2020-06-02
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