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Flexible,high-density,laminated ECoG electrode array for high spatiotemporal resolution foci diagnostic localization of refractory epilepsy

摘要High spatiotemporal resolution brain electrical signals are critical for basic neuroscience research and high-precision focus diagnostic localization,as the spatial scale of some pathologic signals is at the submillimeter or micrometer level.This entails connecting hundreds or thousands of electrode wires on a limited surface.This study reported a class of flexible,ultrathin,high-density electrocorticogram(ECoG)electrode arrays.The challenge of a large number of wiring arrangements was overcome by a laminated structure design and processing technology improvement.The flexible,ultrathin,high-density ECoG electrode array was conformably attached to the cortex for reliable,high spatial resolution electrophysiologic recordings.The minimum spacing between electrodes was 15 μm,comparable to the diameter of a single neuron.Eight hundred electrodes were prepared with an electrode density of 4444 mm-2.In focal epilepsy surgery,the flexible,high-density,laminated ECoG electrode array with 36 electrodes was applied to collect epileptic spike waves in rabbits,improving the positioning accuracy of epilepsy lesions from the centimeter to the submillimeter level.The flexible,high-density,laminated ECoG electrode array has potential clinical applications in intractable epilepsy and other neurologic diseases requiring high-precision electroencephalogram acquisition.

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作者 Yafeng Liu [1] Zhouheng Wang [2] Yang Jiao [2] Ying Chen [3] Guangyuan Xu [4] Yinji Ma [2] Xue Feng [2] 学术成果认领
作者单位 Applied Mechanics Laboratory,Department of Engineering Mechanics,Tsinghua University,Beijing 100084,China;Laboratory of Flexible Electronics Technology,Tsinghua University,Beijing 100084,China;College of Artificial Intelligence,Southwest University,Chongqing 400715,China [1] Applied Mechanics Laboratory,Department of Engineering Mechanics,Tsinghua University,Beijing 100084,China;Laboratory of Flexible Electronics Technology,Tsinghua University,Beijing 100084,China [2] Institute of Flexible Electronics Technology of THU,Jiaxing 314000,China;Qiantang Science and Technology Innovation Center,Hangzhou 310016,China [3] Applied Mechanics Laboratory,Department of Engineering Mechanics,Tsinghua University,Beijing 100084,China;Laboratory of Flexible Electronics Technology,Tsinghua University,Beijing 100084,China;School of Artificial Intelligence,Beijing University of Posts and Telecommunications,Beijing 100876,China [4]
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DOI 10.1007/s42242-024-00278-2
发布时间 2024-08-20(万方平台首次上网日期,不代表论文的发表时间)
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